Reflow Soldering Heat Endurance
Reflow profile parameters
(1) Preheat condition: 150 ~200℃/60~120sec.
(2) Ramp-up rate(TL to TP):3℃/sec. max.
(3) Allowed time above 217℃: 60~90sec.
(4) Allowed time above 230℃: 60sec.
(5) Peak temp: 260℃
(6) Max time at peak temp: 10sec. but for wire wound products,5sec.
(7) Ramp-down rate(TP to TL):6 ℃/sec max.
Recommended solder paste: Sn/3.0Ag/0.5Cu Liquidous temperature TL=217℃ Reflow
Note：
(1) No mechanical and electrical defects are found after testing based on the above profile and keeping under the conditions of room temperature and humidity for 2 hours.
(2) 2 times reflow test is acceptable with the test interval remaining 1 hour under the normal conditions.
(3) This reflow profile is for classification/preconditioning and are not meant to specify board assembly profiles,Actual board assembly profile should be developed based on specific process needs and board designs and should not exceed the parameters listed above.
(4) The reflow test profile may vary with the testing instruments.
